Just because the various components in an advanced package work individually and separately doesn't mean they will work ...

HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.

Moving data is one of the big challenges in the AI world. There is so much data being generated that even moving it back and ...

A new technical paper titled “HBM Roadmap Ver 1.7 Workshop” was published by researchers at KAIST’s TERALAB. The 371-page ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

The choice of DRAM depends on where the action is.

A new technical paper titled “Impact of Parameter Uncertainties on Power Electronic Device Lifetime Predictions” was ...

Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need ...

This is hard enough in hyperscale data centers, which are sprouting up everywhere to handle the training and some inferencing ...

Opinion: The foundry makes all of the logic chips critical for AI data centers, and might do so for years to come.

Catch mistakes early, confirm exceptions are used correctly, and ensure constraints involve in step with the RTL.

IC, AI global ranking; China's fully automated IC design system; Micron goes bigger; PCIe 7.0 spec; TSMC-Tokyo joint lab; ...