The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Power architect Barry Pangrle looks ...

A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: ...

Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by ...

Clock Modulation Covert Channel” was published by researchers at University of Rennes-INSA Rennes-IETR-UMR  and Université ...

Confidential Computing for Embedded RISC-V Systems” was published by researchers at IBM Research, IBM T.J. Watson Research Center, Max Planck Institute for Software Systems (MPI-SWS). Abstract ...

Aware Deep Learning on Resource-Constrained Hardware” was published by researchers at Imperial College London and University of Cambridge. Abstract “The use of deep learning (DL) on Internet of Things ...

As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge ...

Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...