From traditional fuses to eFuses, understanding the advantages, limitations, and use cases of each technology helps engineers ...

Electronics keep shrinking, but silicon is starting to run into physical limits. To go smaller, researchers are turning to ...

Fudan team uses wafer-scale 2D semiconductor integration process to overcome large-scale integration challenges 2D transition metal dichalcogenides (2D-TMDs) are seen as promising candidates for ...

The first CMOS chip was created by Fairchild Semiconductor, presented at ISSCC in 1963. The logic topologies used in today’s textbooks originated in this work. P-type devices are slower than N-type by ...

Why it matters: For decades, scientists have dreamed of building computer chips that use light instead of electricity to process information. While our current silicon chips are incredibly fast, ...

A fascinating new paper from scientists at the AI research nonprofit LAION finds that even the most sophisticated large language models (LLMs) are frequently stumped by the same simple logic question ...

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on ...