The AJ is delighted to introduce the second edition of Working Details [published in print 18 December], following the success of last year’s volume, and marking the continuing revival of a series ...
Abstract: This study focuses on the electromigration behavior and the mean-time-to-failure (MTTF) analysis of SnAgCu solder joints in the temperature range of 130 to 160°C with current density of 0.96 ...
Abstract: This paper focuses on the electrical resistance’s stability of the embedded solder joints. Solder joints are an inseparable part of every printed circuit board, and the stability of its ...
The industry is undergoing a high-value transformation fueled by record solar installations, AI hardware expansion, and ...
EXCLUSIVE: Hadley Robinson (The History of Sound), Upright Citizens Brigade’s Sam Brodnitz, Nat Wolff (Play Dirty) and Max ...
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