The technology platform, previously known as Rapidus AI-Assisted Design Solution (Raads), will be rebranded as Rapidus ...

Siemens unveils PAVE360 Automotive, a new digital twin technology aimed at accelerating next-generation SDV development.

Despite these gains, Micron acknowledged ongoing supply constraints. Mehrotra noted that the company can currently meet only ...

Voyant Photonics has introduced the Helium Platform, the industry’s first fully solid-state frequency-modulated ...

ROHM has announced the launch of two new motor driver integrated circuits (ICs) designed for brushed DC motors: the BD60210FV ...

Phoenix Contact has launched its new M17 PRO hybrid connector, developed in line with the IEC 61076-2-117 standard.

ByteSnap Design outlines predictions for 2026 and how it will mark a decisive transition for embedded and electronics.

Global memory prices are forecast to rise sharply in the first quarter of 2026, extending a trend that has already placed ...

New Electronics talks with Rudy Sengupta - VP and GM, NI Test and Analytics Software, Test and Measurement, Emerson – about ...

STMicroelectronics has introduced the TSZ901 operational amplifier, a device designed to deliver exceptional accuracy, speed, ...

Intl completes second-generation High Numerical Aperture (High-NA) extreme ultraviolet (EUV) lithography system testing.

To enhance analogue and mixed-signal verification, Toshiba has adopted Siemens’ Solido Simulation Suite and Solido Design ...