A new technical paper titled “Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving ...

A new technical paper titled “Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging” was published ...

Bandwidth, Compute, Synchronization, and Capacity are all you need” was published by NVIDIA. Abstract “This paper presents a ...

An new technical paper titled “Fast and Accurate Jitter Modeling for Statistical BER Analysis for Chiplet Interconnect and ...

Every aspect of data center energy use must be optimized to reduce power consumption and enable more sustainability, from ...

How AI is reshaping EDA, and how it will help chipmakers to focus on domain-specific solutions.

Contemporary AI, high-performance computing (HPC), mobile, and automotive designs continue to grow in size and complexity, ...

Abhi agreed. “We have to trust in that hallucination, that innovation to provide us with things that we’ve never seen before, ...

The development of a semiconductor system is more complex than just describing functionality in RTL. How ready are AI models ...

A structured approach ensures consistent IP metadata representation across abstraction levels, design tools, and development ...

LLR sits above the PHY and below the UET layer, ensuring the loss resilience before the higher layers get involved. By fixing ...

Acceleration of Large Language Models with Mixture of Experts via 3D Heterogeneous Integration” was published by researchers ...