KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.

SERS, an extremely sensitive laboratory method of analysing chemical composition, is set to become widespread decades after its invention. The main obstacle that has been slowing down the development ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

TAIPEI, Taiwan — Packaging services provider Advanced Semiconductor Engineering Inc. and PCB maker Compeq Manufacturing Co. Ltd. announced Tuesday (October 28, 2003) that they would set up a joint ...

The growth of large area graphene films with a precisely controlled numbers of layers and stacking orders can open new possibilities in electronics and photonics but remains a challenge. This study ...

Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...

As chip makers look for ways to make their products more powerful, Intel says it has come up with a different way to hold transistors in substrate packages. Currently, the company uses organic ...

Scientists have reported the fabrication and use of single crystal copper-nickel alloy foil substrates for the growth of large-area, single crystal bilayer and trilayer graphene films. Researchers of ...