With photolithography not able to produce circuit lines much thinner than 100nm, a major focus of research into nanotechnology is in developing means to construct circuits that break the 100nm barrier ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Plasma etching is a cornerstone technique in semiconductor fabrication, enabling the precise removal of material layers through the use of ionised gases. This process is essential for fabricating ...

In this technique, fluorine-based plasma chemistry is used for silicon etching, which is combined with a fluorocarbon plasma process to offer sidewall passivation and enhanced selectivity to masking ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...

After years in R&D, a technology called cryogenic etch is re-emerging as a possible option for production as the industry faces new challenges in memory and logic. Cryogenic etch removes materials in ...

An example of directional etching for nanohole arrays of less than 500nm in diameter. (Image: A*STAR Institute of Materials Research and Engineering) Wet etching can be classified into two main types ...

Ion beam expertise is critical to delivering the manufacturing tolerance required for these gratings. Oxford Instruments Plasma Technology has developed a technology to allow optical designers to ...

Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly half of all fab steps rely on ...