All over the world, governments and industry have come together to solve large-scale chip design challenges. Groups such as the U.S. Department of Defense’s Microelectronics Hubs (ME Commons), the EU ...

The concept of hybrid AI in PM, highlighting the connections between the various components of hybrid AI tools for PSE (left), the four selected PM topics (middle), and examples of problems (right) ...

Artificial Intelligence has been used in design and manufacturing for some time, since the deep learning revolution of the early 2010s at least. However, designers, engineers, and architects are ...

Staying inside increasingly narrow process windows as specialty devices scale, diversify, and enter high-volume production.

The allure of modular systems is multifaceted, but perhaps the most important aspect is the efficiency. Standardized components, built off-site in specialized facilities reduce material use, minimize ...

Design considerations such as integration of modular components, ergonomic design and smart technologies reduce downtime and impact overall system performance. In today’s fast-paced distribution and ...