ASML (NASDAQ:ASML) reigns supreme in the semiconductor equipment world, holding a virtual monopoly on extreme ultraviolet (EUV) lithography machines essential for crafting the most advanced chips.

As Intel works to regain its manufacturing edge over TSMC, the company is also expanding its advanced packaging capacity. Complex chips like AI accelerators use advanced packaging techniques instead ...

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

A new technical paper titled “Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging” was published by researchers at University of ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Forward-looking: The Department of Commerce has announced $1.4 billion in awards through the CHIPS National Advanced Packaging Manufacturing Program. While this initiative will contribute to making ...

The packaging of products is one of the most important aspects for every company. Well-thought-out and planned packaging techniques can inhibit or enhance sales. It is financially burdensome to a ...

WASHINGTON, Aug 11 (Reuters) - South Korea's SK Hynix aims to select a U.S. site for its advanced chip packaging plant and break ground there around the first quarter of next year, two people familiar ...