We're all familiar with two dimensional design drawings — not to mention the questions that usually accompany them because they can provide only so much information before becoming hopelessly ...

The diversity of 3D multi-die design further complicates IP requirements. Common topologies, including face-to-face (F2F), ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Samuel Silberman, an incoming PhD student in electrical engineering, has been named a 2025 Draper Scholar by Draper. The prestigious graduate fellowship will support his research into radio frequency ...